As data center workloads continue to grow, traditional air cooling solutions are reaching their limits. Artificial intelligence (AI), machine learning, high-performance computing (HPC), and advanced enterprise applications are driving unprecedented rack densities that require more efficient thermal management strategies.
The Vertiv™ CoolChip CDU (Coolant Distribution Unit) provides a scalable liquid cooling solution designed to support the next generation of high-density computing environments. Engineered for direct-to-chip cooling and rear door heat exchanger (RDHx) applications, the CoolChip CDU enables data centers to efficiently manage high-power IT loads while maintaining precise temperature control, system reliability, and operational flexibility.
With flexible deployment options, advanced monitoring capabilities, and cooling capacities ranging from compact in-rack solutions to large-scale data center deployments, Vertiv CoolChip CDU systems help organizations transition to liquid cooling without unnecessary infrastructure complexity.
Modern processors, GPUs, and AI accelerators generate significantly more heat than traditional server hardware. The Vertiv CoolChip CDU helps overcome these thermal challenges by efficiently distributing coolant to high-density racks and supporting liquid-cooled IT equipment.
By enabling direct-to-chip cooling and rear door heat exchanger applications, CoolChip CDU systems allow organizations to deploy higher-performance computing infrastructure while maintaining stable operating conditions.
Every data center has unique infrastructure requirements. Vertiv CoolChip CDU systems are designed to support multiple architectures, including:
The platform supports both liquid-to-liquid and liquid-to-air heat exchanger configurations, allowing organizations to select the cooling architecture that best fits their facility design.
| CDU model | 70 | 121 | 600 | 1350 | 2300 |
| CDU type | Liquid-to-Air | Liquid-to-Liquid | Liquid-to-Liquid | Liquid-to-Liquid | Liquid-to-Liquid |
| Nominal cooling capacity* |
70 kW at 11°C Approach Temperature Difference (ATD) |
121 kW at 4°C Approach Temperature Difference (ATD) |
600 kW at 4°C Approach Temperature Difference (ATD) |
1368 kW at 4°C Approach Temperature Difference (ATD) |
2300 kW at 4°C Approach Temperature Difference (ATD) |
| Nominal fluid flow rate |
60 l/min (15.8 gpm) |
120 l/min (31.7 gpm) |
900 l/min (238 gpm) |
1200 l/min (317 gpm) |
3400 l/min (898 gpm) |
| Maximum airflow, (N+1 operation) |
10,100 CMH (5,945 CFM) |
n/a | n/a | n/a | n/a |
| Unit dimensions (H x W x D), in (mm) |
91 x 24 x 48 (2300 x 600 x 1200) |
6.89 x 17.52 x 33.46 (175 x 445 x 850) |
78.7 x 23.6 x 47.2 (2000 x 600 x 1200) |
81.6 x 35.4 x 48.9 (2069 x 900 x 1243) |
94.5 x 48 x 48 (2400 x 1200 x 1200) |
| Power supply | 115V, 1PH, 60Hz 230V, 1PH, 50Hz |
110-120V, 1PH, 50/60Hz 208V-240V, 1PH, 50/60Hz 46V-52V VDC |
400V, 3PH, 50/60Hz 480V, 3PH, 60Hz |
400V, 3PH, 50/60Hz 480V, 3PH, 60Hz |
400V, 3PH, 50/60Hz 480V, 3PH, 60Hz |
*Please contact a sales representative for unit performance data based on site conditions.
As rack power requirements continue increasing, liquid cooling provides a more efficient method for removing heat compared to traditional air-based cooling.
The Vertiv CoolChip CDU helps manage high-density workloads by delivering coolant directly where heat is generated, supporting advanced processors and GPU-intensive applications while helping maintain optimal operating temperatures.
Liquid cooling can improve thermal efficiency by reducing dependence on traditional cooling infrastructure. Vertiv CoolChip CDU systems are designed to provide efficient cooling performance while helping reduce long-term operational costs associated with high-density deployments.
Benefits include:
Protecting expensive IT hardware is critical in any liquid cooling deployment. The Vertiv CoolChip CDU incorporates features designed to maintain fluid quality, provide system redundancy, and support reliable operation.
Key reliability features include:
Maintaining consistent coolant temperatures is essential for protecting sensitive processors and GPUs. Vertiv CoolChip CDU systems provide precise temperature management to help prevent thermal shock and maintain stable IT equipment performance.
A built-in 50-micron filter helps maintain coolant quality by reducing contaminants within the secondary fluid loop. This helps protect server components and supports long-term system reliability.
Advanced monitoring features help operators maintain visibility into cooling performance.
Capabilities include:
These features help data center teams quickly identify potential issues before they impact critical infrastructure.
Vertiv CoolChip CDU systems are designed with serviceability in mind. Accessible fill ports, drain locations, and integrated controls simplify installation, maintenance, and ongoing operation.
Innovative stainless-steel construction and hygienic couplings help maintain secondary fluid network integrity while supporting dependable long-term operation.
The Vertiv CoolChip CDU family provides scalable cooling options for environments ranging from individual high-density racks to large enterprise and hyperscale deployments.
Available configurations include:
| Model Capacity | Cooling Application |
|---|---|
| 70 kW | Liquid-to-air cooling applications |
| 100+ kW | Compact in-rack direct-to-chip cooling |
| 450 kW | High-density liquid cooling deployments |
| 600 kW | Enterprise and data center liquid cooling |
| 1,350 kW | Large-scale high-density environments |
| 2,300 kW | Hyperscale and advanced computing facilities |
The demand for higher computing performance is accelerating, and thermal management strategies must evolve alongside new processor technologies. Vertiv CoolChip CDU provides a scalable path toward liquid cooling adoption, helping organizations support AI, HPC, and next-generation workloads with confidence.
Whether you are upgrading an existing data center or designing a new high-density computing environment, Vertiv CoolChip CDU delivers the efficiency, reliability, and flexibility needed for modern infrastructure.
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